Ultrapure Water Mixed Bed Resin for Semiconductor & EDI Systems
Nuclear-grade equivalent mixed bed resin for semiconductor ultrapure water and EDI polishing, achieving resistivity > 18.2 MΩ·cm and TOC < 1 ppb per SEMI F63.
Technical Specifications
| TOC | < 1 ppb |
| standard | SEMI F63 compliant |
| packaging | 25 L sealed bag (inert N₂ atmosphere) |
| appearance | Mixed H-form cation and OH-form anion beads |
| particle size | 0.30–1.25 mm |
| resistivity target | > 18.2 MΩ·cm |
Applications
- Semiconductor fab ultrapure water final polishing
- EDI module resin replenishment
- Power plant condensate polishing
- Pharmaceutical water for injection (WFI) production
- LCD/OLED panel manufacturing process water
Key Features
- Achieves 18.2 MΩ·cm ultrapure water quality
- Ultra-low TOC leaching < 1 ppb — critical for semiconductor yield
- Nuclear-grade mechanical stability — minimal resin fines
- Sealed N₂ packaging preserves ionic form before use
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